Desmond Teck Beng Yeo1, Eric Fiveland1, Randy Giaquinto1, Tingting Song2, Xing Yang2, Keith Park1, Adam B. Kerr3, Xu Chu2, Ileana Hancu1
1GE Global Research, Niskayuna, NY, United States; 2GE Global Research, Shanghai, China; 3Department of Electrical Engineering, Stanford University, Stanford, CA, United States
Inter-element inductive coupling presents an important challenge in parallel transmit coil arrays. An ultra-low output impedance RF amplifier (RFPA) was previously introduced to address this issue. In this work, the improvements in transmit decoupling between the ultra-low output impedance RFPAs and conventional RFPAs under different loading conditions were investigated with two types of coil arrays. Bench tests and imaging studies performed on a 3T MR scanner with 8-channel transmit and receive flat array and cylindrical coils showed improved inter-element transmit decoupling, and, strong correlation between image-based B1+ decoupling measures and inter-element scattering parameters (S21).