size of the on-coil electronics could be one of the major obstacles in building
high density RF coils. First, there is a clear mechanical desire to reduce its
size in order to make the coils lighter and thinner; second, bulky electronics
placed on small loops can disturb the sensitivity profile; third, for MR-PET
applications the RF coils, in addition to the requirements mentioned above,
have to be transparent to PET radiation. In order to achieve these critical to
quality objectives we propose completely embedding all of the lumped components
into a common printed circuit board (PCB).