Markus V. Meissner1, Robert Ch. Meier1, Peter T. While1, Ali Moazenzadeh2, Jan G. Korvink1, 3
1Lab. for Simulation, IMTEK - University of Freiburg, Freiburg, Germany; 2Lab. for Microactuators, IMTEK - University of Freiburg, Freiburg, Germany; 3Freiburg Institute for Advanced Studies FRIAS, University of Freiburg, Freiburg, Germany
We present a micro-integrated gradient chip-design manufactured by using multiple, wire-bonded conductors. By placing the gradient conductors close to a microscopic sample, a particular strong magnetic field gradient can be achieved. The miniaturized gradient coils are based on a customized coil design, manufactured by using micro fabrication technology. A chip design was studied, based on a sandwich structure, consisting of straight, low profile wire-bonded gradient conductors, embedded and aligned by using permanent dry film photo-resist. The gradient conductors are integrated on a 2cmx2cm large glass substrate and the layer-based conductor alignment method enables statically determined bond-wire fixation.