Abstract #1290
Modeling PIN Diode Temperature Rise in High Induced Current MR Receive Coils
Robert Caverly 1 , Ronald Watkins 2 , and William E Doherty 3
1
Villanova University, Villanova, PA, United
States,
2
Department
of Radiology, Stanford University, Stanford, CA, United
States,
3
Microsemi,
Lowell, MA, United States
A new electrothermal SPICE-based model that predicts
both electrical and thermal behavior of PIN diodes used
in high field, high power MR imaging is described. The
model accurately predicts the temperature rise in
blocking applications and is fully compatible with
industry-standard simulators such as SPICE as well as it
variants. Knowledge of the temperature rise in PIN
protection diodes is important because failure rates of
these devices dramatically increase if temperatures
exceed approximately 150 oC, with a potential loss of
patient and equipment protection
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